25
May
Chinese tech giant Huawei has launched a new revolutionary semiconductor design framework to counter strict U.S. export controls. In a major tech forum, the company said it plans to achieve high-end computing performance comparable to a leading-edge 1.4-nanometer process by 2031, thus narrowing the gap with global leaders such as TSMC. With Washington blocking China’s access to the advanced extreme ultraviolet (EUV) lithography machines needed for traditional manufacturing, Huawei is moving away from conventional methods. Rather than focusing only on shrinking transistor sizes—an industry trend known as Moore’s Law that is already approaching atomic-scale limits—Huawei introduced what it calls the…
