Polymatech Electronics, India’s first opto-semiconductor company, launched its latest semiconductor innovations at ISPEC 2025, held at Mahatma Mandir, Gujarat. The event witnessed the unveiling of Sapphire Ingots, Sapphire Wafers, and the 6G Telecom Die by Gujarat Chief Minister Bhupendra Rajnikant Patel, alongside Polymatech CEO and MD Eswara Rao Nandam and ECM Greentech General Manager Anis Jouini.
Polymatech’s new Sapphire Ingots and Wafers are designed for critical applications in LED substrates, power devices, RF mobile components, and semiconductor wafers used in high-frequency and microwave technologies. Their high thermal conductivity, mechanical strength, and optical transparency make them essential for aerospace and military electronics. Meanwhile, the 6G Telecom Die is set to revolutionize next-generation telecom infrastructure with ultra-fast data transfer, AI-driven networks, and massive IoT connectivity. Built for millimeter-wave and terahertz bands, it enables high-speed modulation, energy efficiency, and advanced antenna systems.
CEO Eswara Rao Nandam emphasized the company’s role in India’s semiconductor growth, stating, “Polymatech is driving self-reliance in chip manufacturing, positioning India as a global semiconductor leader.” Polymatech’s joint venture with ECM France further strengthens India’s semiconductor ambitions, aligning with the country’s goal of reaching a $14.09 billion market by 2032.